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Le programme HELIOS développe une filière complète de procédés de fabrication de CI permettant d'intégrer la photonique aux circuits CMOS

HELIOS Program Develops Complete Supply Chain for Integrating Photonics with CMOS Circuit via IC Fabrication Processes

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BeSpoon and Leti Establish World Record Distance Measurement on a Single Chip

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LEXNET Project – Low EMF Exposure Future Networks

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