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> 3D IntegrationNew Leti offers in the field of 3D integration
André Rouzaud (andre.rouzaud@cea.fr)
Basically, “3D heterogeneous integration” aims gathering different micro electronics objects together in order to juxtapose complementary functions (such as sensing, storing, processing, actuation, communication and energy scavenging) and building advanced system solutions in a way that the objects are connected together in the 3 dimensions of the space. This very innovative approach is now mainly driven by the microelectronics sector which is facing a huge challenge for maintaining density increase imposed by Moore’s Law.
In terms of manufacturing, many technical challenges directly stem from the diversity of the components that can be assembled by these technologies, and validations through manufacturing, characterization and reliability analysis of dedicated demonstrators and prototypes are mandatory.
For these reasons, Leti has built a new 3D 300mm line dedicated to integration, satisfying both the requirements of high density integration for advanced microelectronics applications such as memories/memories, logic/logic and memories/logic stacking, as well as the low-medium density integration constraints related to heterogeneous and complex systems.
Inaugurated January 2011 in presence of Leti’s main external partners, this line is now fully operational and allows complete 3D integration demos using TSV middle and last processes.
In parallel of the R&D developments performed to follow the industrial roadmaps of its partners, Leti also offers now standard prototyping activities based on its most mature integration schemes, allowing
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