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06/10/2011
Discover Leti's latest published book :
Electronic Chip Processing and New Interconnection Processes
Edited by Gilles Poupon
Published by Hermes Sciences, 2011 - French only
320 pages
Electronic components are part of our daily lives and are to be found everywhere: in our living rooms, telephones, cars and, sometimes, even inside us as implantable medical devices. Of every type and size, they are an essential element of micro- and nanotechnology. Although they are fabricated collectively, they are sometimes connected and configured individually.
In their first work, the authors introduced us to advanced packaging on silicon. This new work completes the state of the art in this area by explaining the various processes that electronic components undergo after fabrication on a silicon substrate, up to their final packaging.
The book describes the main technological steps that electronic components go through as part of the packaging process, together with the main interconnection methods, which are often selected according to the target application. Lastly, it takes a look at new interconnection technologies adapted to new integration processes, such as through-silicon vias, optical link and electrically conductive adhesives.
To order, visit Hermes Sciences site
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