The first annual MiNaPAD Forum will held be at the Minatec campus in Grenoble, France from 10 to 12 May, 2011. The conference is organized by France chapter of the International Microelectronics and Packaging Society (IMAPS France) and is cosponsored by CEA-LETI and the France chapter of the IEEE/CPMT.

The MiNaPAD event brings together design and package assembly communities with a focus on recent developments in micro- & nano- technologies and their integration into packaging.

The conference will feature :
- Three keynote lectures from internationally recognized speakers
- 40 technical papers organized into 10 technical session with 40% of the contribution coming from outside of France
- An exhibition with 30 suppliers and subcontractors from Europe, United States and Asia
- Four half-day tutorials given by experts in their subject areas: (i) Thermal Management, (ii) 3D Integration Technology, (iii) Packaging Interconnection Technology and (iv) Package Reliability.With the positive feedback received so far, more than 250 participants are expected to attend the first annual MiNaPad forum.

We look forward to see you in Grenoble !

Program :

MiNaPAD program (409.20 kB)