New Global Offer Includes Design, Layout, Testing and Packaging on Leti Platforms

Device would be eight-times smaller than current models

Development of a unified hardware/software design platform for complex systems-on-chip

Controller puts vacuum pumps and abatement system in idle mode when processing equipment is not running

Four partners affiliated with CEA in the Rhone-Alpes region are combining their expertise in the Nano-ENO Project to develop an injectable tracer1 that can provide both nuclear imaging in the pre-operative evaluation of tumors and optical imaging during ablation or biopsy.

CEA-Leti will significantly expand its technology offering this month when it ramps up one of Europe’s first 300mm lines dedicated to 3D-integration applications.

Ou comment suivre les pompiers pour améliorer leur sécurité

The Captaucom program, launched in 2005, has now achieved all its objectives. Three self-powered communicating prototype devices have been developed for the benefit of the three manufacturers involved in the program.

RYB, the French leader in piping systems and polyethylene networks, chose the Pollutec exhibition (30 November to 3 December 2010 in Lyon) as a platform to unveil the world’s first smart, detectable plastic pipe

Designed for defense and security applications, array achieves sensitivity close to one-thousandth of a degree Kelvin

CEA-Leti will present 10 papers, including two invited papers, at the IEDM/IEEE 2010 International Electron Devices Meeting Dec. 6-8, in San Francisco, Calif.

“Fully Networked, Digital Components for Photon-starved Biomedical Imaging Systems” – is a new collaborative research project funded by the European Union within the Information and Communication Technologies (ICT) Theme of its Seventh Research Framework Programme (FP7).

CEA-Leti, coordinator of the European HELIOS project to accelerate commercialization of silicon photonics, said today project partners demonstrated a laser and a 10Gb/s silicon modulator using a process that is compatible with complementary metal-oxide semiconductor (CMOS) processing.

Atrenta Inc.,the leading provider of Early Design Closure® solutions to radically improve design efficiency throughout the IC design flow, announced today the signing of a multi-year collaboration agreement with CEA-Leti.

The California Institute of Technology (Caltech) and CEA-Leti, co-founders of the NanoVLSI Alliance, have launched the NanoSystems Partnership Program (NSyP) to accelerate delivery of nanosystems-based innovations to the market.

CEA-Leti and SPP Process Technology Systems (SPTS) today announced they have agreed to develop advanced 300mm through-silicon via (TSV) 3D-IC processes at CEA Leti’s 300mm facilities in Grenoble, France.

CEA-Leti announced that it has demonstrated the efficient integration of silicon photonic devices with fully complementary metal-oxide semiconductor (CMOS)-compatible plasmonic optical waveguides.

CEA-Leti and CMP (Circuits Multi Projets®) announced during the FDSOI Workshop at Tokyo University the launch of an Exploratory MPW (Multi Project Wafers) initiative based on FDSOI (Fully Depleted SOI) 20nm process, opening the access of its 300mm infrastructure to the design community.

CEA-Leti has won two prestigious awards for created and innovative companies in the 12th Business Creation Contest sponsored by the Ministry for High Education and Research. The winning projects are:ASELTA Nanographics and ETHERA.

CEA-Leti announced that it has demonstrated a contactless, very high-speed interface for RFID smartcards.

CEA-Leti today announced that it is has opened a complete 300mm fab extension dedicated to 3D-integration applications. Final equipment installations will continue through to the end of this year with an inauguration event planned in January, 2011.

CEA-Leti has designed and created a unique 3D interactive-modeling tool, based on a new user interface that could change the way urban-planning projects are presented.

CEA-Leti announced that after extensive beta testing at five French research facilities, its new imaging system for near-infrared fluorescence-enhanced diffuse optical tomography (fDOT) is ready for commercial applications.

CEA-Leti has developed a digital baseband circuit for software-defined-radio and cognitive-radio applications that features less than 50 microseconds (µs) for full reconfiguration and multi-applications support.

CEA-Leti and Docea Power will combine their expertise in 3D silicon integration and thermal and low-power design.

Leti, a leading global research center committed to creating and commercializing innovation in micro- and nanotechnologies, today presented results at the SOI Industry Consortium workshop in Leuven, Belgium, that prove SOI-based planar CMOS meets requirements for lowpower, 22nm node devices, offering a practical route to further feature shrink and enabling a significant jump for “green” products.

Leti, a leading global research center committed to creating and commercializing innovation in micro- and nanotechnologies, and the California Institute of Technology (Caltech) will present their joint nanosystem roadmaps at a Nov. 10 workshop at Caltech in Pasadena, Calif.

Leti, the leading research and development institute focused on micro- and nano-technologies, announced today that it has broken new ground in the integration of nanotechnology with traditional complementary metal oxide semiconductor (CMOS) chip technology. CMOS is the most widely used technology for manufacturing silicon integrated circuits.

Le Leti, l’un des principaux instituts de recherche et développement spécialisé dans la micro et la nanotechnologie, a annoncé aujourd’hui une découverte importante dans le domaine des nanotechnologies. Celle-ci devrait permettre la combinaison d’une approche émergeante, l’auto-assemblage, et de la technologie traditionnelle de fabrication des composants électroniques CMOS (Compatible Metal Oxide Semiconductor).

Leti, a leading global research center committed to creating and commercializing innovation in micro- and nanotechnologies, said today that more than 300 engineers, researchers and industry leaders from around the world are expected to attend Embedded Systems Week, Oct. 11-16, in Grenoble’s World Trade Center.

CEA-Leti and MAPPER Lithography announce today that MAPPER has delivered one of its massively parallel electron beam platforms to CEA-Leti.

Replisaurus Technologies, Inc. today announced a common laboratory agreement with CEA-Leti, which maintains one of the world's leading research centers for applied electronics in Grenoble, France.

TSMC (TWSE: 2330, NYSE: TSM) and CEA-Leti, the leading French semiconductor research institute, signed an agreement today in which TSMC will join the new industrial program IMAGINE, led by CEA-Leti, on maskless lithography for IC manufacturing.

Leti, a leading global research center committed to creating and commercializing innovation in micro- and nanotechnologies, announced today that it has launched a new company, Fluoptics, that will improve surgery of some types of cancers.

Leti, a leading global research center committed to creating and commercializing innovation in micro- and nanotechnologies, is hosting a workshop on innovative memory technologies at MINATEC on Wednesday, June 24.

Leti and Ecole Polytechnique Fédérale de Lausanne (EPFL) have begun a monthly seminar series for students and professionals to discuss technical issues facing micro- and nanotechnology researchers.

Leti and Brewer Science, Inc. signed a common lab agreement to combine their expertise in integration and materials into ultra-thin wafer processing flows for 3 Dimensional Packaging using Brewer Science temporary adhesives. They are also collaborating in the development of photosensitive and non-photosensitive coatings for MEMS manufacturing processes.