PLAT4M Project Focused on Speeding Industrialization of the Technology
GRENOBLE, France – Nov.12, 2015 – CEA-Leti and its partners in the European FP7 project PLAT4M today announced they have built three silicon photonics platforms. The four-year project, which launched in 2013, aims at building a European-based supply chain in silicon photonics and speeding industrialization of the technology. PLAT4M, which is funded by a European Commission grant of 10.2 million euros, includes 15 leading European R&D institutes and CMOS companies, key industrial and research organizations in design and packaging, as well as end users in different application fields, to build the complete supply chain.
The Innovative-company-support Project Started in February 2015. 15 EuroCPS Members from Nine Countries Are Now Supporting Nine Projects out of the First Call. The Second Call for Industrial Projects Is Now open.
GRENOBLE, France – Nov. 19, 2015 – CEA-Leti, coordinator of the pan-European consortium EuroCPS, today announced that the 15 partners are continuing their support for SMEs, midcaps and large companies with the second open call for industrial projects, which is open from Oct. 28 to Dec. 2. Innovative cyber-physical system (CPS) projects can be submitted.
Three high-tech SMEs finalize the joint EU-funded PICS project on innovative ALD materials and manufacturing equipment
Caen, Oct. 22, 2015 – Two years after the launch of the PICS project (funded by the FP7 funding instrument dedicated to research for the benefit of SMEs), three European SMEs, IPDiA, Picosun and SENTECH Instruments along with CEA-Leti and Fraunhofer IPMS-CNT announce the major technological results achieved during this program.
Paris, France, 21st October 2015 - Significant advances in silicon photonic integrated circuits (PICs) have been achieved in the European FP7 project SEQUOIA (energy efficient Silicon Emitter using heterogeneous integration of III-V QUantum dOt and quantum dash materIAls).
The project carries two major innovations: the use of novel III
dot (Qdot) and quantum dash (Qdash) based materials, and the exploitation of novel photonic device concepts through hybrid III-V/silicon integration.
GRENOBLE, France – Oct. 13, 2015 – Patrick Boisseau, chairman of the European Technology Platform on Nanomedicine (ETPN), said today that nanomedicine in Europe is rapidly progressing from a primarily academic-research-oriented and fragmented field to a multi-national program sharply focused on bringing the benefits of nanomedicine to all Europeans.
GLOBALSOLUTIONSSM Partnership Will Enable Leti’s FD-SOI and ASICS Design-and-Fabrication Solutions on GLOBALFOUNDRIES Technologies
CEA-Leti today announced that it has joined the GLOBALSOLUTIONS ecosystem as an ASIC provider, specifically to support GLOBALFOUNDRIES’ 22FDX™ technology platform.
In what may be a first for the MEMS industry, CEA-Leti has manufactured micro-accelerometers on 300mm wafers, a development that could lead to significantly lower MEMS manufacturing costs.
GRENOBLE and EVRY, France – July 21, 2015 – CEA-Leti and Diabeloop today announced their joint lab to develop an artificial pancreas to improve treatment for Type 1 diabetes patients.
GRENOBLE, France – July 09, 2015 – IRT Nanoelec, an R&D consortium focused on Information and Communication Technologies (ICT) using micro- and nanoelectronics, and its partners CEA-Leti, STMicroelectronics and Mentor Graphics have realized an innovative 3D chip called “3DNoC” to demonstrate the use of 3D stacking technology in scalable, complex digital systems-on-chip (SoCs).
GRENOBLE, France – July 13, 2015 – CEA-Leti today announced its first results towards the demonstration of CoolCube’s feasibility in FinFET technology on its 300mm production line, and new CoolCubeTM circuit designs that improve the trade off between area, speed and power.
GRENOBLE, France, and ST. FLORIAN AM INN, Austria – July 15, 2015 – CEA-Leti and EV Group have launched a new program in nano-imprint lithography (NIL) called INSPIRE to demonstrate the benefits of the versatile, powerful nanopatterning technology and spread its use for applications beyond semiconductors.
GRENOBLE, France – July 7, 2015 – An international research consortium coordinated by CEA-Leti announced the launch of BIOCAPAN , a research project funded by the European Commission aiming at developing an innovative GMP-grade (good manufacturing practices) cell-therapy product to treat diabetes without insulin injections.
Project Combines Expertise of 9 Partners in 8 Countries to Foster Nanomedicine Innovation and Facilitate Regulatory Approval
GRENOBLE, France – July 1, 2015 – CEA-Leti today announced the launch of the European Nano-Characterisation Laboratory (EU-NCL) funded by the European Union’s Horizon 2020 research and innovation programm e. Its main objective is to reach a level of international excellence in nanomedicine characterisation for medical indications like cancer, diabetes, inflammatory diseases or infections, and make it accessible to all organisations developing candidate nanomedicines prior to their submission to regulatory agencies to get the approval for clinical trials and, later, marketing authorization.
Leti-and-Soitec Spinout Focused on Becoming Leading European Source Of GaN Devices for Solar, Automotive, Telecoms and Infrastructure
GRENOBLE, France – June 23, 2015 – Exagan, a start-up innovator of galliumnitride (GaN) semiconductor technology that enables smaller and more efficient electrical converters, today announced it has raised €5.7 million in first-round financing that will be used to produce high-speed power switching devices on 200mm wafers.
Leti Experts also Will Speak at TechXPOT Session on MEMS and STS Session on Lithography Cost-and-Productivity Issues Below 14nm
GRENOBLE, France – June 22, 2015 – CEA-Leti is hosting its 5th annual LetiDay San Francisco event, “Going Vertical with Leti: Solutions to new applications using 3D technologies”, during SEMICON West.
GRENOBLE, France – June 16, 2015 – CEA-Leti will host a workshop on major trends in Fully Depleted Silicon-on-Insulator process and design technologies in connection with the 17th annual LetiDays Grenoble, June 24-25.
Eight Partners Combine Expertise and Facilities for One-stop-shop Services To Speed Development of Energy-Efficient Products for IoT and other Uses
GRENOBLE, France – June 8, 2015 – CEA-Leti announced today that seven partners have joined its new FD-SOI IC development program, Silicon ImpulseTM, launched to provide a comprehensive IC technology platform that offers IC design, advanced intellectual property, emulator and test services along with industrial multi-project wafer (MPW) shuttles.
Gallium-nitride (GaN) and Indium Gallium-nitride (InGaN) Technology Targets Fast-growing Markets for Wearable Vision Systems
GRENOBLE, France – June 2, 2015 – CEA-Leti today announced that it has demonstrated a path to fabricating high-density micro-LED arrays for the next generation of wearable and nomadic systems in a process that is scalable to the IC manufacturing process.
New European Source of Gallium Nitride-based Power Switches Designed To Speed Adoption of More Efficient Production
And Electrical Conversion Systems to Reduce CO2 Emissions
CEA-Leti and Exagan today announced a strategic partnership to develop and industrialize new large-scale GaN-on-silicon power-switching technology to accelerate the power-electronics industry’s transition to smaller and more efficient electrical converters.
15 EuroCPS Members from Nine Countries Will Assemble Networks for One-stop-shop Services to Ease Product Development and Create Jobs for European Companies15 EuroCPS Members from Nine Countries Will Assemble Networks for One-stop-shop Services to Ease Product Development and Create Jobs for European Companies
End-to-end Design Accelerator Platform Targets Energy-efficient Internet of Things Applications and New Devices Using FD-SOI Technology, while Expanding Ecosystem
CEA-Leti today announced the launch of its Silicon Impulse IC design competence center, a comprehensive IC technology platform offering IC design, advanced intellectual property, emulator and test services along with industrial multi-project wafer (MPW) shuttles.
CEA-Leti today announced the newest version of its advanced compact model for UTBB-FDSOI technology is now available in all major SPICE simulators.
Leading European wireless communications companies to demonstrate millimeter-wave technologies for 5G at Mobile World Congress
GRENOBLE, France – Feb. 25, 2015 – CEA-Leti will present updates on its silicon photonics technology, including its results on “heterogeneously integrated III-V on silicon distributed feedback lasers at 1310nm” and hybridization of electronic and photonic ICs at OFC 2015, March 22-26, at the Los Angeles Conference Center in Los Angeles, Calif.
In addition, Hughes Metras, Leti’s vice president for strategic partnerships, North America, will participate in a panel discussion on “State of the Market/Industry: 2014 in Review,” beginning at 12:30 p.m. on March 24 in the Exhibit Hall. His topic is “The Promises of Silicon Photonics: Current Status and Future Trends.”
Leti staff will be available at booth No. 635 in the Exhibit Hall to elaborate on the results and answer questions.
Launch of the gateone Innovation Action, an innovation service for SMEs
GRENOBLE, France – Oct. 9, 2014 – IRLYNX and CEA-Leti today announced they have launched a technology-development partnership for a new CMOS-based infrared technology that will allow a new type of smart and connected detectors in buildings and cities.