Leti, an institute of CEA Tech, the Taipei Computer Association (TCA) and SEMI Taiwan will host a workshop "Imagine your future with Leti" from 9 a.m. to noon on Monday, Oct. 3, with a focus on some of Leti's latest developments in micro- and nanotechnologies and its vision of how these technologies will impact industry in the future.
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Leti, an institute of CEA Tech, announced today that Leti has ordered a HERCULES NIL track system from EV Group. The HERCULES NIL system will be installed in Leti's cleanroom facility in Grenoble, where it will augment the process-development and demonstration capabilities available to participants in the collaborative EVG-Leti INSPIRE program.
Leti, an institute of CEA Tech, and OT (Oberthur Technologies), a leading global provider of embedded security software products and services, today announced they have signed a letter of intent to collaborate on a wide range of technologies and digital solutions for security and performance in a connected world.
An international project to develop technology and architectures for mimicking neural behavior in integrated circuits will review the state of the art in creating neuromorphic circuits and bring together the device and design communities for this promising field on Sept. 12 in Lausanne, Switzerland.
BigClouT Program Will Add Big-data Analytics, Edge Computing and Self-aware Equipment For New Tools and Applications in Four European and Japanese Cities
Following validation of its innovative smart-city tools that combine Internet of Things and cloud-computing technologies, the EU-Japan ClouT consortium will expand its goals and add cities and partners in the new BigClouT program. The expanded program will focus on distributed intelligence with edge-computing principles, big-data analytics capability and self-aware property.
Leti, an institute of CEA Tech, and the Korea Institute of Science and Technology (KIST) today announced an agreement to jointly explore a variety of technologies, including monolithic 3D, neuromorphic architectures, non-volatile 3D memory, spintronics and ultra-low power semiconductors.
Leti, a CEA Tech institute, today announced it has developed a new on-chip communications system to improve high-performance computing (HPC) that is faster and more energy efficient than current solutions and is compatible with 3D architectures.
Leti, an institute of CEA Tech, and Nova Measuring Instruments (Nasdaq: NVMI), a leading innovator and a key provider of metrology solutions for advanced process control used in semiconductor manufacturing, announced today a joint program to develop innovative metrology methods to enable leading-edge process control solutions for multi e-beam and directed self-assembly (DSA) advanced lithography techniques. Based on this new joint initiative, Nova has already installed its advanced suite of products at Leti's state-of-the-art facility in France.
Three Grenoble-based research and medical partners have been selected to join the European Union-funded IDentIFY project to significantly extend the capability of magnetic resonance imaging (MRI) in disease detection.
The four-year IDentIFY project brings together the complementary expertise of universities and research centers in U.K, Finland, France, Germany, Italy, and Poland. It is coordinated by the University of Aberdeen in Scotland U.K.
The French IDentIFY partners are CEA (led by Leti, a CEA Tech institute, and Inac), INSERM, and G2ELab.
The CEA (Atomic Energy Commission) and Intel are boosting their collaboration through a new R & D agreement signed in Paris on Thursday 12 May. This collaboration, extended to several key areas in digital technology, will enable the two sides to develop a shared R&D programme and jointly submit research and innovation projects on a European scale, particularly as regards High Performance Computing (HPC), as part of the Horizon 2020 programme.
Leti, an institute of CEA Tech, today announced the continuation of its collaboration with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to develop CoolCube™, Leti’s new sequential integration technology that eliminates the need for through-silicon vias (TSVs) and enables the stacking of active layers of transistors in the third dimension.
Leti, an Institute of CEA Tech, will present six papers, including an invited one on “Universal Signatures from Non-Universal Memories: Clues for the Future…”, during the 2016 International Memory Workshop, May 15-18, at the Paris Marriott Rive Gauche Hotel.
Collaboration also Focusing on Applying Grenoble Area’s Med-tech Expertise and Developing Turnkey Solutions for Companies
Leti, an Institute of CEA Tech, and ARaymondlife*, a manufacturer of customized devices and consumables for the IVD industry today announced a joint initiative to accelerate the development and manufacturing of innovative medical devices, especially in the field of microfluidic cartridge analysis.
Shanghai, China and Grenoble, France –– March 16, 2016 — SITRI, the innovation center for accelerating the development and commercialization of “More than Moore” solutions to power the Internet of Things, and CEA-Leti, the Grenoble, France-based research and technology organization focused on creating value and innovation through technology transfer to industrial partners, in affiliation with MINATEC, the Grenoble, France-based innovation campus, announced the signing of a comprehensive agreement for ongoing collaboration and cooperation in developing new technologies to power the emerging Internet of Things (IoT) market.
A team from Leti and the University of Grenoble-Alps, along with Leti’s international partners, have developed a technique to diagnose performance problems of nanoresonators, nanosensors used in industry, research and medical diagnosis.
These nano-electrical-mechanical systems (NEMS) have never been able to operate at full capacity. The discrepancy between the theoretical limit of detection and the degraded practical limit has not been explained until now. The researchers were able to understand this phenomenon thanks to their new approach, which is featured in this month’s Nature Nanotechnology, published Feb. 29, and are working on a solution to this problem.
Three major Pilot Lines, which help SMEs take photonics technologies from lab into market, have been launched today by the Photonics Public Private Partnership (PPP).
The Pilot Lines mean that thousands of high tech SMEs in Europe - who often lack access to advanced, cost-intensive infrastructures and expertise needed to manufacture new and innovative products – will be able to take their good ideas, scale-them up and validate them with the first customers for commercial production. The Pilot Lines will focus on health applications, flexible organic light-emitting diodes and sensors for the detection of chemicals in gas and liquids. The European Commission has invested €35 million in these projects to boost Europe's industrial competitiveness. This is part of the Commission's €700 million investment in the Photonics Public Private Partnership over the seven years of Horizon 2020, the Framework Programme for Research and Innovation.
Feb. 8-10 Event Is Part of EU-Japanese Collaboration on 5G Systems and Networks, and the ‘Japanese-French Year of Innovation’
GRENOBLE, France – Feb. 3, 2016 – CEA-Leti will make two presentations during the EU-Japan Symposium on 5G, ‘From Challenges to Standardisation’, in Tokyo, Feb. 8-10. The purpose of the gathering of European and Japanese stakeholders such as the European Commission, industry manufacturers, telecommunication operators, service providers, regulators, research organizations and government ministries is to discuss Japanese and EU perspectives for development of 5G communications systems and networks.
GRENOBLE, France – Jan. 25, 2016 – Leti will host a workshop from 4-6 p.m. on Tuesday, Feb. 16, during SPIE Photonics West, focusing on some of its recent developments in photonics applications. Leti researchers also will present four invited papers, 14 overall, during the Feb. 13-18 conference in San Francisco’s Moscone Center.
France – Dec. 15, 2015 – CEA-Leti, a leading applied-research institute for microelectronics, will demonstrate at CES 2016 three disruptive innovations, ranging from ultra-high-brightness, augmented-reality glasses to extremely highspeed wireless data transmission between mobile devices, and the world’s first TV white-space modem limiting interference in adjacent spectrum bands.
The three demonstrations at Eureka Park in the Sands hotel mark Leti’s first formal participation at CES, and reflect the institute’s growing focus on applied technologies for consumer market solutions.