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Leti to Present at 5G Symposium,‘From Challenges to Standardisation’, in Tokyo


Feb. 8-10 Event Is Part of EU-Japanese Collaboration on 5G Systems and Networks, and the ‘Japanese-French Year of Innovation’

GRENOBLE, France – Feb. 3, 2016 – CEA-Leti will make two presentations during the EU-Japan Symposium on 5G, ‘From Challenges to Standardisation’, in Tokyo, Feb. 8-10. The purpose of the gathering of European and Japanese stakeholders such as the European Commission, industry manufacturers, telecommunication operators, service providers, regulators, research organizations and government ministries is to discuss Japanese and EU perspectives for development of 5G communications systems and networks.

Leti to Host Workshop on New Photonics Applications During SPIE Photonics West


GRENOBLE, France – Jan. 25, 2016 – Leti will host a workshop from 4-6 p.m. on Tuesday, Feb. 16, during SPIE Photonics West, focusing on some of its recent developments in photonics applications. Leti researchers also will present four invited papers, 14 overall, during the Feb. 13-18 conference in San Francisco’s Moscone Center.

Leti to Demonstrate Three Consumer Technology Breakthroughs at CES 2016


Five Startups Launched by Leti, Leading International Nanotech Research Institute

Also Will Exhibit at Eureka Park

France – Dec. 15, 2015 – CEA-Leti, a leading applied-research institute for microelectronics, will demonstrate at CES 2016 three disruptive innovations, ranging from ultra-high-brightness, augmented-reality glasses to extremely highspeed wireless data transmission between mobile devices, and the world’s first TV white-space modem limiting interference in adjacent spectrum bands.

The three demonstrations at Eureka Park in the Sands hotel mark Leti’s first formal participation at CES, and reflect the institute’s growing focus on applied technologies for consumer market solutions.

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Leti Develops Local-strain Techniques in FD-SOI Fabrication To Improve Next-Generation Performance, Energy Use


GRENOBLE, France – Dec. 8, 2015 – CEA-Leti today announced it has developed two techniques to induce local strain in FD-SOI processes for next-generation FD-SOI circuits that will produce more speed at the same, or lower, power consumption, and improve performance.

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Leti to Collaborate with Keysight Technologies To Enable Expansion of FD-SOI Technology


Agreement with Industry-leading, Device-modeling Software Supplier Will Improve Access to Leti-UTSOI Extraction Methodology

GRENOBLE, France – Dec. 7, 2015 – CEA-Leti today announced it has signed an agreement with Keysight Technologies, the industry-leading device-modeling software supplier, to adapt Leti’s UTSOI extraction flow methodology within Keysight’s device modeling solutions for high-volume SPICE model generation.

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CEA-Leti and CEA-Inac Pave the Way for Quantum Information Processing on SOI CMOS Platform


GRENOBLE, France – Dec. 7, 2015 – CEA-Leti today announced preliminary steps for demonstrating a quantum bit, or qubit, the building block of quantum information, in a process utilizing a silicon-on-insulator (SOI) CMOS platform.

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CEA-Leti to Share Insights into Post-7-nanometer Technologies At Workshop Prior to IEDM in Washington, D.C.


Research Includes CMOS Device Architectures, New Materials and Computing System Paradigms

GRENOBLE, France – Dec. 1, 2015 – As part of its ongoing mission to help its industrial partners implement competitive, leading-edge semiconductor capabilities, CEA-Leti will present new details about its R&D efforts in post-7-nanometer CMOS device architectures, materials and computing-system paradigms during IEDM 2015.

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Leti and Partners in Silicon Photonics Supply-Chain Project Announce Developments on Three Mature Platforms


PLAT4M Project Focused on Speeding Industrialization of the Technology

GRENOBLE, France – Nov.12, 2015 – CEA-Leti and its partners in the European FP7 project PLAT4M today announced they have built three silicon photonics platforms. The four-year project, which launched in 2013, aims at building a European-based supply chain in silicon photonics and speeding industrialization of the technology. PLAT4M, which is funded by a European Commission grant of 10.2 million euros, includes 15 leading European R&D institutes and CMOS companies, key industrial and research organizations in design and packaging, as well as end users in different application fields, to build the complete supply chain.

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NAREB: a EU-funded research project for combating antibiotic resistance


18th November 2015: European Antibiotic Awareness Day

The World Health Organization has declared antibiotic resistance as one of the three greatest threats to human health. This has promoted extensive efforts world wide in order to, for example, implement strategies for a rational use of already existing antibiotics, aimed at stopping and reversing the increasing incidence of infections caused by drug resistant microorganisms, such as methicillin resistant Staphylococcus aureus (MRSA) and multidrug resistant Mycobacterium tuberculosis (MDT-TB).

EuroCPS, a Horizon 2020 Project, Announces Next Round Of Support for Innovative Companies and their CPS projects


The Innovative-company-support Project Started in February 2015. 15 EuroCPS Members from Nine Countries Are Now Supporting Nine Projects out of the First Call. The Second Call for Industrial Projects Is Now open.

GRENOBLE, France – Nov. 19, 2015 – CEA-Leti, coordinator of the pan-European consortium EuroCPS, today announced that the 15 partners are continuing their support for SMEs, midcaps and large companies with the second open call for industrial projects, which is open from Oct. 28 to Dec. 2. Innovative cyber-physical system (CPS) projects can be submitted.

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Successful industrialization of high-density 3D integrated silicon capacitors for ultra-miniaturized electronic components


Three high-tech SMEs finalize the joint EU-funded PICS project on innovative ALD materials and manufacturing equipment

Caen, Oct. 22, 2015 – Two years after the launch of the PICS project (funded by the FP7 funding instrument dedicated to research for the benefit of SMEs), three European SMEs, IPDiA, Picosun and SENTECH Instruments along with CEA-Leti and Fraunhofer IPMS-CNT announce the major technological results achieved during this program.

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III-V Quantum dots & dashes on Silicon: a brekthrough towards efficient 16 x 25 Gb/s WDM photonic integrated circuits


Paris, France, 21st October 2015 - Significant advances in silicon photonic integrated circuits (PICs) have been achieved in the European FP7 project SEQUOIA (energy efficient Silicon Emitter using heterogeneous integration of III-V QUantum dOt and quantum dash materIAls).

The project carries two major innovations: the use of novel III
dot (Qdot) and quantum dash (Qdash) based materials, and the exploitation of novel photonic device concepts through hybrid III-V/silicon integration.

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EU Nanomed Association to Strongly Support Innovation and Bringing New Medicines to Market


GRENOBLE, France – Oct. 13, 2015 – Patrick Boisseau, chairman of the European Technology Platform on Nanomedicine (ETPN), said today that nanomedicine in Europe is rapidly progressing from a primarily academic-research-oriented and fragmented field to a multi-national program sharply focused on bringing the benefits of nanomedicine to all Europeans.

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Leti Joins GLOBALFOUNDRIES’ Eco-System Partners With Focus on Supporting 22FDX™ Platform


GLOBALSOLUTIONSSM Partnership Will Enable Leti’s FD-SOI and ASICS Design-and-Fabrication Solutions on GLOBALFOUNDRIES Technologies

CEA-Leti today announced that it has joined the GLOBALSOLUTIONS ecosystem as an ASIC provider, specifically to support GLOBALFOUNDRIES’ 22FDX™ technology platform.

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Leti Demos MEMS Fabrication on its 300mm Line, Pointing the Way to Lower Manufacturing Costs


In what may be a first for the MEMS industry, CEA-Leti has manufactured micro-accelerometers on 300mm wafers, a development that could lead to significantly lower MEMS manufacturing costs.

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Leti and Diabeloop Project Aims at Developing Artificial Pancreas for Diabetes Treatment


GRENOBLE and EVRY, France – July 21, 2015 – CEA-Leti and Diabeloop today announced their joint lab to develop an artificial pancreas to improve treatment for Type 1 diabetes patients.

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IRT Nanoelec Partners Achieve 3D Chip-stacking Technology & 3D Network-on-chip Framework for Digital Processing


GRENOBLE, France – July 09, 2015 – IRT Nanoelec, an R&D consortium focused on Information and Communication Technologies (ICT) using micro- and nanoelectronics, and its partners CEA-Leti, STMicroelectronics and Mentor Graphics have realized an innovative 3D chip called “3DNoC” to demonstrate the use of 3D stacking technology in scalable, complex digital systems-on-chip (SoCs).

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Leti Reports FinFET Feasibility and Circuit Design for Better Area, Speed and Power Trade-offs with CoolCube Technology


GRENOBLE, France – July 13, 2015 – CEA-Leti today announced its first results towards the demonstration of CoolCube’s feasibility in FinFET technology on its 300mm production line, and new CoolCubeTM circuit designs that improve the trade off between area, speed and power.

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Leti and EVG Launch INSPIRE, a Lithography Program Aimed At Demonstrating Benefits of Nano-imprint Technology


GRENOBLE, France, and ST. FLORIAN AM INN, Austria – July 15, 2015 – CEA-Leti and EV Group have launched a new program in nano-imprint lithography (NIL) called INSPIRE to demonstrate the benefits of the versatile, powerful nanopatterning technology and spread its use for applications beyond semiconductors.

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Leti and Eight Partners in BIOCAPAN Project Working On Diabetes Treatment that Replaces Insulin Injections


GRENOBLE, France – July 7, 2015 – An international research consortium coordinated by CEA-Leti announced the launch of BIOCAPAN , a research project funded by the European Commission aiming at developing an innovative GMP-grade (good manufacturing practices) cell-therapy product to treat diabetes without insulin injections.

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Leti Announces Launch of First European Nanomedicine Characterisation Laboratory


Project Combines Expertise of 9 Partners in 8 Countries to Foster Nanomedicine Innovation and Facilitate Regulatory Approval

GRENOBLE, France – July 1, 2015 – CEA-Leti today announced the launch of the European Nano-Characterisation Laboratory (EU-NCL) funded by the European Union’s Horizon 2020 research and innovation programm e. Its main objective is to reach a level of international excellence in nanomedicine characterisation for medical indications like cancer, diabetes, inflammatory diseases or infections, and make it accessible to all organisations developing candidate nanomedicines prior to their submission to regulatory agencies to get the approval for clinical trials and, later, marketing authorization.

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Exagan Raises €5.7 Million to Produce High-efficiency GaN-on-Silicon Power-switching Devices on 200mm Wafers


Leti-and-Soitec Spinout Focused on Becoming Leading European Source Of GaN Devices for Solar, Automotive, Telecoms and Infrastructure

GRENOBLE, France – June 23, 2015 – Exagan, a start-up innovator of galliumnitride (GaN) semiconductor technology that enables smaller and more efficient electrical converters, today announced it has raised €5.7 million in first-round financing that will be used to produce high-speed power switching devices on 200mm wafers.

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Leti to Present Solutions to New Applications Using 3D Technologies at SEMICON West LetiDay Event, July 14


Leti Experts also Will Speak at TechXPOT Session on MEMS and STS Session on Lithography Cost-and-Productivity Issues Below 14nm

GRENOBLE, France – June 22, 2015 – CEA-Leti is hosting its 5th annual LetiDay San Francisco event, “Going Vertical with Leti: Solutions to new applications using 3D technologies”, during SEMICON West.

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Leti Workshop Covers Major Trends in FDSOI Technologies Before LetiDays Grenoble, June 24-25


GRENOBLE, France – June 16, 2015 – CEA-Leti will host a workshop on major trends in Fully Depleted Silicon-on-Insulator process and design technologies in connection with the 17th annual LetiDays Grenoble, June 24-25.

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Leti launches new Silicon ImpulseTM FD-SOI Development Program, to Help Designers Broaden the Use of FD-SOI for Low-power Applications


Eight Partners Combine Expertise and Facilities for One-stop-shop Services To Speed Development of Energy-Efficient Products for IoT and other Uses

GRENOBLE, France – June 8, 2015 – CEA-Leti announced today that seven partners have joined its new FD-SOI IC development program, Silicon ImpulseTM, launched to provide a comprehensive IC technology platform that offers IC design, advanced intellectual property, emulator and test services along with industrial multi-project wafer (MPW) shuttles.

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Leti Demos New Process to Fabricate High-brightness Micro-LED Arrays for Next-gen Head-mounted and Head-up Displays


Gallium-nitride (GaN) and Indium Gallium-nitride (InGaN) Technology Targets Fast-growing Markets for Wearable Vision Systems

GRENOBLE, France – June 2, 2015 – CEA-Leti today announced that it has demonstrated a path to fabricating high-density micro-LED arrays for the next generation of wearable and nomadic systems in a process that is scalable to the IC manufacturing process.

More information

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Leti and Exagan Partnership Targets Faster GaN-on-silicon Technology Integration Roadmap for Power-electronics Industry


New European Source of Gallium Nitride-based Power Switches Designed To Speed Adoption of More Efficient Production
And Electrical Conversion Systems to Reduce CO2 Emissions

CEA-Leti and Exagan today announced a strategic partnership to develop and industrialize new large-scale GaN-on-silicon power-switching technology to accelerate the power-electronics industry’s transition to smaller and more efficient electrical converters.

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Pan-European Project to Help Innovative Companies Design and Build New Cyber-physical Systems Products for IoT Markets


15 EuroCPS Members from Nine Countries Will Assemble Networks for One-stop-shop Services to Ease Product Development and Create Jobs for European Companies15 EuroCPS Members from Nine Countries Will Assemble Networks for One-stop-shop Services to Ease Product Development and Create Jobs for European Companies

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Silicon Impulse, New Leti IC Design Platform, Offers One-Stop-Shop


End-to-end Design Accelerator Platform Targets Energy-efficient Internet of Things Applications and New Devices Using FD-SOI Technology, while Expanding Ecosystem

CEA-Leti today announced the launch of its Silicon Impulse IC design competence center, a comprehensive IC technology platform offering IC design, advanced intellectual property, emulator and test services along with industrial multi-project wafer (MPW) shuttles.

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CEA-Leti today announced the newest version of its advanced compact model for UTBB-FDSOI technology is now available in all major SPICE simulators.

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MiWaves demonstrate millimeter-wave technologies for 5G


Leading European wireless communications companies to demonstrate millimeter-wave technologies for 5G at Mobile World Congress

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GRENOBLE, France – Feb. 25, 2015 – CEA-Leti will present updates on its silicon photonics technology, including its results on “heterogeneously integrated III-V on silicon distributed feedback lasers at 1310nm” and hybridization of electronic and photonic ICs at OFC 2015, March 22-26, at the Los Angeles Conference Center in Los Angeles, Calif.

In addition, Hughes Metras, Leti’s vice president for strategic partnerships, North America, will participate in a panel discussion on “State of the Market/Industry: 2014 in Review,” beginning at 12:30 p.m. on March 24 in the Exhibit Hall. His topic is “The Promises of Silicon Photonics: Current Status and Future Trends.”

Leti staff will be available at booth No. 635 in the Exhibit Hall to elaborate on the results and answer questions.

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gateone project


Launch of the gateone Innovation Action, an innovation service for SMEs

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IRLYNX and CEA-Leti to Streamline New CMOS-based Infrared Sensing Modules Dedicated to Human-activities Characterization


GRENOBLE, France – Oct. 9, 2014 – IRLYNX and CEA-Leti today announced they have launched a technology-development partnership for a new CMOS-based infrared technology that will allow a new type of smart and connected detectors in buildings and cities.