au service de l'industrie
In keeping with its mission to develop photolithography alternatives for advanced technology nodes and offer competitive solutions adapted to specific applications, Leti is developing technologies for directed self-assembly lithography (DSA), massively parallel electron beam lithography and nanoimprint lithography.
GRENOBLE, France - Feb. 3, 2017 - Leti, a research institute of CEA Tech, today announced it has developed a μLED fabrication process to create high-resolution arrays at 10-micron pitch. That pixelization and the 873 x 500 resolution that are enabled by the new process exceed state-of-the-art technology.
Leti, a technology research institute of CEA Tech, today announced a European project to develop a portable and wearable, multisensor and low-power spatial-exploration and obstacle-detection system for all conditions of weather and visibility.
Jan. 10, 2017 - Leti, a research institute of CEA Tech, today announced it will deploy a 5G framework on the MINATEC campus in Grenoble to demonstrate a new post-OFDM (orthogonal frequency-division multiplexing) multicarrier waveform.
Leti, a technology research institute at CEA Tech, will demonstrate the first bicycle-pedal power meter under $100 at CES 2017 that measures both strength applied on the pedal and pedaling cadence, and then combines them to deliver the cyclist's power output in real time.
Leti, a technology research institute at CEA Tech, will demonstrate at CES 2017 a wearable device that takes measurement of brain-activity - alpha waves - out of the clinic and puts it into the hands of consumers.
SIGMA FUSION, Leti's innovative low-cost solution for autonomous cars, transforms the myriad of incoming distance data into clear information about the driving environment. This efficient perception system, which Leti will demonstrate at CES 2017, combines, merges and feeds exhaustive data to an autonomous car's autopilot, providing all it needs to guarantee safe driving. It is able to detect any kind of obstacle and to assess obstacle-free spaces for safe route navigation.
Leti, an institute of CEA Tech, has developed a new light-sensing device that integrates photodiodes below the buried oxide (BOX) of FDSOI transistors, making the transistors very sensitive to visible light.
A Leti research project presented at IEDM 2016 today clarified for the first time the correlation between endurance, window margin and retention of resistive RAM (RRAM), a non-volatile random-access memory.
Leti, an institute of CEA Tech, presented two papers at IEDM 2016 today that demonstrate its ability to provide industry with all the elements required for building a competitive 5-nm node with nanowire architectures.
Leti researchers have demonstrated that memristive devices are excellent candidates to emulate synaptic plasticity, the capability of synapses to enhance or diminish their connectivity between neurons, which is widely believed to be the cellular basis for learning and memory.
Leti CEO Marie Semeria today delivered a sweeping, optimistic assessment of a rapidly evolving world where "hyperconnectivity" and the Internet of Things - guided by a "human-centered research approach and symbiotic development strategies" - herald profound changes in the way individuals relate to each other and to the physical world.
"SCREEN Semiconductor Solutions Co., Ltd. (SCREEN) and Leti, a CEA Tech institute, today announced they have stepped up their collaboration with the installation at Leti's site of a nanosecond-scale UV laser anneal LT-3100 system to be delivered by Laser Systems and Solutions of Europe (LASSE), SCREEN's subsidiary based in France"
Leti, an institute of CEA Tech, along with Inac, a fundamental research division of CEA, and the University of Grenoble Alpes have achieved the first demonstration of a quantum-dot-based spin qubit using an industry-standard fabrication process.
Leti, an institute of CEA Tech, announced the launch of a European Commission Horizon 2020 project to enable mass commercialization of Si-photonics-based transceivers to meet future data-transmission requirements in data centers and super computing systems.
Leti CEO Marie Semeria will help kick off IEDM 2016 with an opening-day keynote address on Monday, Dec. 5, titled "Symbiotic Low-Power, Smart and Secure Technologies in the Age of Hyperconnectivity". The institute also will present 13 papers, including three invited ones at the Dec. 3-7 gathering in San Francisco.
Leti, an institute of CEA Tech, and three French partners are collaborating in a "house-cleaning" project aboard the International Space Station that will investigate antibacterial properties of new materials in a zero-gravity environment to see if they can improve and simplify cleaning inside spacecraft.
Leti, an institute of CEA Tech, and PYXALIS, a French SME specializing in high-performance image sensors, today announced a new technology that lowers readout noise for image sensors down to 0.5 electron noise and dramatically improves low-light image sensing capabilities.
EUROSERVER, a leading EU-funded research project, is paving the way toward lower energy consumption in data centers. Based on the concept of chiplets, where multiple silicon subsystems are mounted in an integrated device, along with an associated new groundbreaking system architecture, the project has enabled more energy-efficient servers and has even inspired startups motivated by the new technology.
Scientists at Leti, an institute of CEA Tech, will give four presentations at SEMICON Europa, Oct. 25-27, in Grenoble, and Leti's Patterning Program Manager Laurent Pain will chair a session on lithography. Leti also will present multiple product demos in a wide range of fields that showcase how its advanced technology has gone from research to final product.
Leti, an institute of CEA Tech, and the Institute for Information Industry of Taiwan (III), a non-profit non-governmental technology development organization, today announced an agreement for mutual exploration of a wide range of information and communications technology (ICT) related to the Internet of Things (IoT) and 5G wireless connectivity.
Leti, an institute of CEA Tech, announced today it has joined the Stanford SystemX Alliance, a network of 100 renowned Stanford University professors and 27 world-class companies, joining forces in a pre-competitive environment to define tomorrow's research strategies. Leti's participation bridges the gap between two worlds - academia and industry.
Leti, an institute of CEA Tech, the Taipei Computer Association (TCA) and SEMI Taiwan will host a workshop "Imagine your future with Leti" from 9 a.m. to noon on Monday, Oct. 3, with a focus on some of Leti's latest developments in micro- and nanotechnologies and its vision of how these technologies will impact industry in the future.
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Leti, an institute of CEA Tech, announced today that Leti has ordered a HERCULES NIL track system from EV Group. The HERCULES NIL system will be installed in Leti's cleanroom facility in Grenoble, where it will augment the process-development and demonstration capabilities available to participants in the collaborative EVG-Leti INSPIRE program.
Leti, an institute of CEA Tech, and OT (Oberthur Technologies), a leading global provider of embedded security software products and services, today announced they have signed a letter of intent to collaborate on a wide range of technologies and digital solutions for security and performance in a connected world.
An international project to develop technology and architectures for mimicking neural behavior in integrated circuits will review the state of the art in creating neuromorphic circuits and bring together the device and design communities for this promising field on Sept. 12 in Lausanne, Switzerland.
BigClouT Program Will Add Big-data Analytics, Edge Computing and Self-aware Equipment For New Tools and Applications in Four European and Japanese Cities
Following validation of its innovative smart-city tools that combine Internet of Things and cloud-computing technologies, the EU-Japan ClouT consortium will expand its goals and add cities and partners in the new BigClouT program. The expanded program will focus on distributed intelligence with edge-computing principles, big-data analytics capability and self-aware property.
Leti, an institute of CEA Tech, and the Korea Institute of Science and Technology (KIST) today announced an agreement to jointly explore a variety of technologies, including monolithic 3D, neuromorphic architectures, non-volatile 3D memory, spintronics and ultra-low power semiconductors.
Leti, a CEA Tech institute, today announced it has developed a new on-chip communications system to improve high-performance computing (HPC) that is faster and more energy efficient than current solutions and is compatible with 3D architectures.
Leti, an institute of CEA Tech, and Nova Measuring Instruments (Nasdaq: NVMI), a leading innovator and a key provider of metrology solutions for advanced process control used in semiconductor manufacturing, announced today a joint program to develop innovative metrology methods to enable leading-edge process control solutions for multi e-beam and directed self-assembly (DSA) advanced lithography techniques. Based on this new joint initiative, Nova has already installed its advanced suite of products at Leti's state-of-the-art facility in France.
Trois équipes de chercheurs français (CEA, Inserm, et G2ELab) s'associent dans le cadre du projet européen IDentIFY pour développer un nouveau type de scanner IRM moins coûteux et beaucoup plus précis. Le projet IDentIFY a pour objectif de développer une nouvelle technique d'IRM appelée IRM à champ magnétique cyclé (Fast Field-Cycling IRM, ou FFC-IRM), puis de montrer sa capacité à caractériser des signaux issus des tissus vivants, et de contribuer à sa commercialisation. Les instituts Leti et Inac (CEA, UGA) disposent d'une importante expertise dans les technologies nécessaires à la technique FFC-IRM.
Le CEA et Intel renforcent leur collaboration au travers d'un nouvel accord de R&D signé à Paris le jeudi 12 mai 2016. Cette collaboration, étendue à plusieurs domaines clés du numérique, permettra au CEA et à Intel de développer un programme de R&D commun, et de répondre conjointement aux appels à projet dans le domaine de la recherche et de l'innovation au niveau européen, particulièrement pour le calcul haute performance (HPC) dans le cadre du programme H2020.
Leti, an institute of CEA Tech, today announced the continuation of its collaboration with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to develop CoolCube™, Leti’s new sequential integration technology that eliminates the need for through-silicon vias (TSVs) and enables the stacking of active layers of transistors in the third dimension.
Leti, an Institute of CEA Tech, will present six papers, including an invited one on “Universal Signatures from Non-Universal Memories: Clues for the Future…”, during the 2016 International Memory Workshop, May 15-18, at the Paris Marriott Rive Gauche Hotel.
La collaboration entre le Leti et ARaymondlife vise également à valoriser l'expertise grenobloise en technologies médicales et le développement de solutions clés en main pour les entreprises
Le Leti, Institut de CEA Tech et ARaymondlife, fabricant de dispositifs et de consommables sur mesure pour l’industrie du diagnostic in vitro, ont annoncé aujourd'hui la mise en place d’une collaboration privilégiée basée sur la complémentarité de compétences dans le développement et la fabrication de dispositifs médicaux innovants, en particulier dans le domaine des supports d’analyses microfluidiques.
Shanghai, China and Grenoble, France –– March 16, 2016 — SITRI, the innovation center for accelerating the development and commercialization of “More than Moore” solutions to power the Internet of Things, and CEA-Leti, the Grenoble, France-based research and technology organization focused on creating value and innovation through technology transfer to industrial partners, in affiliation with MINATEC, the Grenoble, France-based innovation campus, announced the signing of a comprehensive agreement for ongoing collaboration and cooperation in developing new technologies to power the emerging Internet of Things (IoT) market.
A team from Leti and the University of Grenoble-Alps, along with Leti’s international partners, have developed a technique to diagnose performance problems of nanoresonators, nanosensors used in industry, research and medical diagnosis.
These nano-electrical-mechanical systems (NEMS) have never been able to operate at full capacity. The discrepancy between the theoretical limit of detection and the degraded practical limit has not been explained until now. The researchers were able to understand this phenomenon thanks to their new approach, which is featured in this month’s Nature Nanotechnology, published Feb. 29, and are working on a solution to this problem.
Three major Pilot Lines, which help SMEs take photonics technologies from lab into market, have been launched today by the Photonics Public Private Partnership (PPP).
The Pilot Lines mean that thousands of high tech SMEs in Europe - who often lack access to advanced, cost-intensive infrastructures and expertise needed to manufacture new and innovative products – will be able to take their good ideas, scale-them up and validate them with the first customers for commercial production. The Pilot Lines will focus on health applications, flexible organic light-emitting diodes and sensors for the detection of chemicals in gas and liquids. The European Commission has invested €35 million in these projects to boost Europe's industrial competitiveness. This is part of the Commission's €700 million investment in the Photonics Public Private Partnership over the seven years of Horizon 2020, the Framework Programme for Research and Innovation.
Feb. 8-10 Event Is Part of EU-Japanese Collaboration on 5G Systems and Networks, and the ‘Japanese-French Year of Innovation’
GRENOBLE, France – Feb. 3, 2016 – CEA-Leti will make two presentations during the EU-Japan Symposium on 5G, ‘From Challenges to Standardisation’, in Tokyo, Feb. 8-10. The purpose of the gathering of European and Japanese stakeholders such as the European Commission, industry manufacturers, telecommunication operators, service providers, regulators, research organizations and government ministries is to discuss Japanese and EU perspectives for development of 5G communications systems and networks.
GRENOBLE, France – Jan. 25, 2016 – Leti will host a workshop from 4-6 p.m. on Tuesday, Feb. 16, during SPIE Photonics West, focusing on some of its recent developments in photonics applications. Leti researchers also will present four invited papers, 14 overall, during the Feb. 13-18 conference in San Francisco’s Moscone Center.
France – Dec. 15, 2015 – CEA-Leti, a leading applied-research institute for microelectronics, will demonstrate at CES 2016 three disruptive innovations, ranging from ultra-high-brightness, augmented-reality glasses to extremely highspeed wireless data transmission between mobile devices, and the world’s first TV white-space modem limiting interference in adjacent spectrum bands.
The three demonstrations at Eureka Park in the Sands hotel mark Leti’s first formal participation at CES, and reflect the institute’s growing focus on applied technologies for consumer market solutions.